UT22VP10C-25PCAデータシート： Radiation Hardened PAL. CMOS I/O 25ns propagation delay. Lead finish solder.

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- Radiation Hardened PAL. CMOS I/O 20ns propagation delay. Lead finish solder.
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- Radiation Hardened PAL. CMOS I/O 20ns propagation delay. Prototype flow. Lead finish solder.
UT22VP10C-20PPA
- Radiation Hardened PAL. CMOS I/O 20ns propagation delay. Prototype flow. Lead finish solder.
UT22VP10C-20PPA
- Radiation Hardened PAL. CMOS I/O 20ns propagation delay. Prototype flow. Lead finish solder.
UT22VP10C-20PPC
- Radiation Hardened PAL. CMOS I/O 20ns propagation delay. Prototype flow. Lead finish gold.
UT22VP10C-20UCX
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UT22VP10C-20UPA
- Radiation Hardened PAL. CMOS I/O 20ns propagation delay. Prototype flow. Lead finish solder.
UT22VP10C-20UPC
- Radiation Hardened PAL. CMOS I/O 20ns propagation delay. Prototype flow. Lead finish gold.

UT22VP10C-25PCAデータシート規格

メーカー : UTMC

パッキン : DIP

ピン : 24

温度 : 分 -55 °C | マックス 125 °C

サイズ : 315 KB

アプリケーション : Radiation Hardened PAL. CMOS I/O 25ns propagation delay. Lead finish solder.