GL-266B-70-2.9同様の

  • GL-200B-85-2.2
    • Geode Processor Series Low Power Integrated x86 Solutions
  • GL-233P-85-2.5
    • Geode Processor Series Low Power Integrated x86 Solutions
  • GL-266B-70-2.9
    • Geode Processor Integrated x86 Solution with MMX Support
  • GL-266B-85-2.9
    • Geode Processor Integrated x86 Solution with MMX Support
  • GL-266B-85-2.9
    • Geode Processor Integrated x86 Solution with MMX Support
  • GL-266P-70-2.9
    • Geode Processor Integrated x86 Solution with MMX Support
  • GL-266P-70-2.9
    • Geode Processor Integrated x86 Solution with MMX Support
  • GL-266P-85-2.9
    • Geode Processor Integrated x86 Solution with MMX Support

GL-266B-70-2.9データシート規格

メーカー : National Semiconductor 

パッキン : EBGA 

ピン : 352 

温度 : 分 0 °C | マックス 0 °C

サイズ : 4504 KB

アプリケーション : Geode Processor Integrated x86 Solution with MMX Support 

GL-266B-70-2.9 PDFダウンロード

GL-266B-70-2.9 PDF